Bond 63/37 Tin/Lead Soldering Paste T3. Weight - 500 grams 0 W Simple

Bond 63/37 Tin/Lead Soldering Paste T3. Weight - 500 grams 0 W Simple  (Flat Tip)

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Highlights
  • Inclusions: NA
  • Power Requirements: Cordless, 0 W
  • Not Temperature Controlled
  • Tip: Flat, Metal
  • Maximum Temperature: 235 degree C
  • Pack of: 1
Description
Characteristics: 1. NCS 63 solder paste is a state of the art made by using high thixotropic no-clean flux and oxide-free spherical powder. This paste is formulated to minimize soldering defects and long term reliability with defect-free performance. 2. No clean flux residues are non-tacky and non-corrosive which gives long terms electrical reliability hence no post solder cleaning is required. 3. No change in viscosity after continuous printing thus gives stable printing on high-density electronic assemblies. 4. No bridging, No solder ball, and No slumping after continuous printing. 5. Shiny and smooth solder joints. INSTRUCTIONS TO USE: a. SOFTENING BEFORE USING:- Take out the solder paste from the refrigerator and keep it at room temperature for 1~1.5 hr. Stir it in softening machine at 300 to 400 RPM for 2-3 minutes. Or stir by using a spatula for approximately 3-4 minutes. b. Do not keep the speed of softening machine too high c. Add sufficient quantity of solder paste on the stencil. d. Keep the container of solder paste airtight to avoid moisture interruption. Otherwise, moisture interruption may result in solder balls/flakes.
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Specifications
Important Note
  • You, the customer hereby represent and undertake that you are of legal age for purchase and use of this product. You undertake that you will use the product for domestic, and/or agricultural purposes only and in a safe and legal manner, consistent with all applicable laws, safety rules, and good common sense. Further, you represent that you will take such steps as may be reasonably necessary or required by applicable law to keep the product out of the hands of minors, untrained and/or unsound mind individuals. Flipkart shall not assume any consequences, loss, damage or injury, that may arise from the violent or illegal use, or misuse of the product sold by the independent Sellers on the Flipkart platform. It is the responsibility of the customer to handle the product with due care and its intended and legitimate use as a tool. Flipkart does not represent or warrant that the customer may legally purchase, own, or possess the product. Please check the laws and regulations outlined by Law Enforcement Agencies in your local jurisdiction before purchasing and keeping the product in possession.
In The Box
Sales Package
  • 63/37 T3 Solder Paste
Pack of
  • 1
General
Brand
  • Bond
Inclusions
  • NA
Type
  • Not Temperature Controlled
Model Number
  • 63/37 Tin/Lead Soldering Paste T3. Weight - 500 grams
Maximum Temperature
  • 235 degree C
Net Quantity
  • 1
Tip Features
Tip Material
  • Metal
Tip Shape
  • Flat
Power Features
Power Source
  • Cordless
Power Consumption
  • 0 W
Dimensions
Weight
  • 0.5 kg
Additional Features
  • Minimizes Soldering defects and long term reliability with defect free performance. Shiny and smooth solder joints., No clean flux residues are non-tacky and non-corrosive which gives long terms electrical reliability hence no post solder cleaning is required., No change in viscosity after continuous printing thus gives stable printing on high-density electronic assemblies. No bridging, No solder ball, and No slumping after continuous printing., INSTRUCTIONS TO USE: a. SOFTENING BEFORE USING:- Take out the solder paste from the refrigerator and keep it at room temperature for 1-1.5hr. Stir it in softening machine at 300 to 400 RPM for 2-3 mins or stir by using a spatula for approx. 3-4 mins., b. Do not keep the speed of softening machine too high c. Add sufficient quantity of solder paste on the stencil. d. Keep the container of solder paste airtight to avoid moisture interruption. Otherwise, moisture interruption may result in solder balls/flakes., Expiry Date - 28 Dec 2021
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