RAREGEAR 30 gm Thermal Grease Paste Heat Sink Compound for CPU and Chipsets ( Pack Of 3) Carbon Based Thermal Paste

RAREGEAR 30 gm Thermal Grease Paste Heat Sink Compound for CPU and Chipsets ( Pack Of 3) Carbon Based Thermal Paste (30 g 1.93 W/mK)

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RAREGEAR 30 gm Thermal Grease Paste Heat Sink Compound for CPU and Chipsets ( Pack Of 3) Carbon Based Thermal Paste  (30 g 1.93 W/mK)

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  • Delivery
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      Delivery by28 Apr, Monday|Free
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      if ordered before 6:59 PM
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    Highlights
    • silicon thermal paste
    Services
    • Cash on Delivery available
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    ShivaanshEnterpises
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  • Description
    " Grey Thermal Grease Heat Sink Compound is a non-curing, water resistant paste heavily filled with heat conductive metallic oxides in a Silicone base. It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component / device. Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers. Also used as a non-flammable coating for fly back transformer connections in TV chassis and similar applications. Features : High Thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C. "
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    Specifications
    In The Box
    • 3
    General
    Brand
    • RAREGEAR
    Model Number
    • 30gm Thermal Grease Paste Heat Sink Compound for CPU and Chipsets (Grey)
    Model Name
    • 30 gm Thermal Grease Paste Heat Sink Compound for CPU and Chipsets ( Pack Of 3)
    Type
    • Carbon Based
    Quantity
    • 30 g
    Viscosity
    • 200 Pa-s
    Thermal Conductivity
    • 1.93 W/mK
    Composition
    • Aluminum Oxide, Zinc Oxide
    Net Quantity
    • 30 g
    Additonal Features
    Other Features
    • It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component / device
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